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EBV Electrolink
Building 13, Pinewood Office Park, 33 Riley Road, Woodmead
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Durban
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Johannesburg
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Cape Town
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News from EBV Electrolink: |
AMD Artix evaluation platform
30 September 2024, DSP, Micros & Memory, EBV Electrolink
The Avnet AUBoard 15P Development Kit is a new evaluation platform designed for engineers to rapidly begin developing solutions around AMD Artix UltraScale+ FPGAs, based on a production-proven 16 nm architecture.
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Entry-level MCU with classical peripherals
30 August 2024, DSP, Micros & Memory, EBV Electrolink
NXP’s MCX C04x microcontrollers feature an Arm Cortex-M0+ core up to 48 MHz and offer 32 KB Flash, 2 KB SRAM, and 8 KB boot ROM. |
QLC Flash memory with the latest BiCS technology
31 July 2024, Analogue, Mixed Signal, LSI, EBV Electrolink
KIOXIA has implemented the groundbreaking CBA (CMOS directly Bonded to Array) technology, which enables the creation of higher density devices and an industry-leading interface speed of 3,6nbsp;Gbps. |
Webinar: Game-changing Matter standard
30 April 2024, Telecoms, Datacoms, Wireless, IoT, EBV Electrolink
Join Infineon for an exclusive one-hour webinar with EBV Elektronik, exploring the groundbreaking Matter standard, and its profound implications for the future of smart homes. |
General-purpose MCU with RISC-V architecture
30 April 2024, DSP, Micros & Memory, EBV Electrolink
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
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AI-native IoT platform launched
30 April 2024, AI & ML, EBV Electrolink
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience. |
Serial SRAM up to 4 MB
30 April 2024, DSP, Micros & Memory, EBV Electrolink
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
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Flash for AI
28 March 2024, AI & ML, EBV Electrolink
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
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Powering up the intelligent edge
28 March 2024, DSP, Micros & Memory, EBV Electrolink
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
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