Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset with the new device now being able to deliver up to 1650 W of continuous output power.

KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.

An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.

Power Integrations has announced MotorXpert v3.0, a software suite for configuration, control and sensing of BLDC inverters that utilise the company’s BridgeSwitch motor-driver ICs.

KIOXIA Europe GmbH was named as winner in the Memory & Storage category of the Embedded Computing Design (ECD) electronica Best in Show Awards at the recently held electronica 2024.

Ultra-Wideband, the robust wireless communications technology commonly known as UWB, is such a versatile technology, capable of doing so many different things, that it can be hard to categorise.

KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.

Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.

The Trimension NCJ29Dx family is part of NXP’s portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range MCU.